AMD已经预告，将在1月4日的CES 2022活动上预览Zen 4架构的部分信息。AMD has announced that it will preview part of the Zen 4 architecture at the CES 2022 event on January 4.
Someone who broke the news sneaked away some details about Zen 4, and I don't know how much it will be able to sit down in the end.
Specifically, AMD Zen4 is based on TSMC’s 5nm process, I/O Die is 6nm, IPC is 25% higher than Zen3, and the factory frequency will exceed 5GHz.
The consumer-grade processor corresponding to Zen4 is the Ryzen 7000 series, which adopts the AM5 interface (LGA1718), supports dual-channel DDR5 memory (not supporting DDR4), 28 PCIe 4.0 channels, and supports transmission features such as NVMe 4.0 and USB 3.2/4.0.
There is also a widespread rumor that the Ryzen 7000 desktop CPU will integrate GPU units, up to 4CU (256 six processors), but the architecture is RDNA2, so it can still kill the Intel core display.
In addition, the X670 chipset matched with Zen4 Ryzen 7000, because of the large area, it is impossible to make small boards of ITX and below.
AMD Zen4 exposure: IPC increased by 25%, frequency surpassed 5GHz netizens sharp evaluation. I am used to eating too many silly forks of toothpaste. I’m so happy that I haven’t eaten something with 4 cores and 8 threads for AMD’s life. This is Intel’s.
有爆料人偷跑了一些关于Zen 4的细节，不知道最终能坐实几何。Zen 4架构，目前看最快也得明年年中或者第三季度才会发布。
具体来说，AMD Zen4基于台积电5nm工艺，I/O Die为6nm，IPC较Zen3提升25%，出厂频率将冲破5GHz。 从目前的消息看，AMD Zen4架构将会采用台积电5nm工艺制造，其中桌面版代号Raphael，改用新的封装接口AM5，支持DDR5、PCIe 5.0，集成RDNA2 GPU；移动版代号Phoenix，支持DDR5，最多8核心16线程，预计也会集成RDNA2 GPU。
Zen4对应的消费级处理器是锐龙7000系列，采用AM5接口（LGA1718），支持双通道DDR5内存（不支持DDR4），28条PCIe 4.0通道，支持NVMe 4.0、USB 3.2/4.0等传输特性。
此前还有一则流传甚广的传言是，锐龙7000桌面CPU会集成GPU单元，最高4CU（256个六处理器），但架构是RDNA2，所以仍旧可以秒杀Intel核显。
另外，与Zen4锐龙7000相搭配的是X670芯片组，因为面积大，没法再做ITX及以下的小板。
AMD Zen4曝光：IPC提升25%、频率冲破5GHz
网友犀利评价 吃惯了吃牙膏的傻叉太多，没amd一辈子吃着4核8线程的东西还开心不已，这可是intel的哦
