AMD早已官宣,将在下半年推出5nm工艺、Zen4架构的锐龙7000系列处理器,支持DDR5内存、PCIe 5.0总线,并改用新的AM5封装接口。

但是,AMD一直没有明确,是否还会继续同时支持DDR4内存?

Tom’s Hareware从多个消息源确认,锐龙7000系列将仅支持DDR5内存,至少搭配X670、B650主板的时候如此。

还不清楚的是,是否有一种可能,锐龙7000系列的内存控制器同时支持DDR4/DDR5,后续搭配新一代A系列主板的时候,可以继续选择DDR4内存?

目前看来这种可能性非常低,路线图上尚未看到新一代A系列主板的迹象,只希望能在后期跟进。

果真如此的话,无疑将是锐龙7000平台的一大劣势:DDR5内存短期内的价格依然昂贵,而且相对DDR4内存并无明显的性能优势,仅支持DDR5无疑会大大降低AMD新平台的吸引力。

哪怕未来增加一款“A550”主板,继续支持DDR4内存,强迫X670、B650主板支持DDR5,也会劝退一大堆消费者。

要知道,Intel今年底的Raptor Lake 13代酷睿,仍然会保留支持DDR4。

另外一个重大变化就是芯片组。

X670、B650都将由继续老伙伴祥硕代为操刀,采用台积电6nm工艺。

B650芯片组通过PCIe 4.0 x4通道连接锐龙7000处理器,但对部分型号来说可能会支持PCIe 5.0。

同时,它会提供八条PCIe 4.0(一半给M.2)、四个SATA、大量USB。

X670将首次采用小芯片设计,相当于把两颗B650合二为一,规格自然翻倍,包括十六条PCIe 4.0、八个SATA、更多USB。

AMD has already officially announced that it will launch the Ryzen 7000 series processors with 5nm process and Zen4 architecture in the second half of the year, support DDR5 memory, PCIe 5.0 bus, and switch to the new AM5 package interface.

However, AMD has not been clear, will it continue to support DDR4 memory at the same time?

Tom’s Hareware confirmed from multiple sources that the Ryzen 7000 series will only support DDR5 memory, at least when paired with X670 and B650 motherboards.

What is not clear is whether there is a possibility that the memory controller of the Ryzen 7000 series supports DDR4/DDR5 at the same time, and can continue to choose DDR4 memory when it is paired with a new generation of A series motherboards?

It seems that this possibility is very low at present, and there is no sign of a new generation of A-series motherboards on the roadmap, and I only hope to follow up in the later stage.

If this is the case, it will undoubtedly be a major disadvantage of the Ryzen 7000 platform: DDR5 memory is still expensive in the short term, and there is no obvious performance advantage over DDR4 memory. Only supporting DDR5 will undoubtedly greatly reduce the attractiveness of AMD’s new platform.

Even if an “A550” motherboard is added in the future, it will continue to support DDR4 memory, and force the X670 and B650 motherboards to support DDR5, it will discourage a lot of consumers.

You know, Intel’s Raptor Lake 13th-generation Core at the end of this year will still retain support for DDR4.

Another big change is the chipset.

Both X670 and B650 will be handled by Xiangshuo, an old partner, using TSMC’s 6nm process.

The B650 chipset connects to the Ryzen 7000 processor via PCIe 4.0 x4 lanes, but may support PCIe 5.0 for some models.

At the same time, it will provide eight PCIe 4.0 (half to M.2), four SATA, and a lot of USB.

The X670 will use a small chip design for the first time, which is equivalent to combining two B650s into one, and the specifications will naturally double, including sixteen PCIe 4.0, eight SATA, and more USB.

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